About the CTO AI Group
Intel’s CTO AI Group is at the forefront of Intel’s AI strategy. We shape the strategy, systems, software, and silicon to move AI from potential to performance. Our team reaches across the company to drive AI forward – joining an agile, innovation-first culture with Intel’s massive scale to deliver leading-edge breakthroughs and solve real-world AI challenges. Together, we’re not just advancing AI — we're engineering it.
About the Role
We are seeking an exceptionally motivated and experienced Silicon Development Engineer to lead the architecture/micro-architecture definition and design of complex System-on-Chip (SoC) solutions. This role demands extensive understanding of SoC Architecture, Digital IP, and Network-on-Chip Interconnect design, coupled with significant pre/post-silicon debug expertise. The successful candidate will be instrumental in defining and implementing chassis architectures for advanced high-compute/performance SoCs.
Key Responsibilities:
Minimum Qualifications
BS in electrical engineer or computer science with 12+ years of experience
8+ Years of in silicon development engineering, with a strong focus on complex SoC Architecture.
5+ years of experience in experience in pre/post silicon debug.
5+ Years of experience with Memory & High-Speed interfacing
Deep understanding of Full chip System bus/fabric architecture (Coherent & Non-coherent).
Proven expertise in building SoCs with complex traffic class system with real time high throughput traffic management.
Strong background in Synthesis & Timing Analysis (Design Compiler/Primetime).
Experience with SOC Partitioning & Floor planning & strong awareness of technology nodes.
Preferred Qualifications
Strong understanding of latest DIE2DIE interfaces like UCIE & high-speed peripherals (PCIE) & Low speed peripherals (UART, SPI, CAN)
Solid knowledge of Multi-core infrastructure & IPC communication for efficient & performance SoC (looks good)
Proficiency with Simulation, Validation, and Signoff tools (IUS, Verdi, CDC, RDC, Lint).’’ (looks good)
Experience with 3nm chiplet-based SoC & chassis architecture.
Familiarity with UCIE based chiplet designs.
Hands-on experience with AMBA/CHI/UCIE/PCIE compliant High throughout interconnects.
Prior experience in leading microarchitecture and design for consumer/wireless/automotive/Server HPC SoCs.
Proven track record of defining and implementing low power, isolation & power management architectures.
Experience with third-party IP evaluation and liaison
Demonstrated experience in leading Digital IP teams and function lead roles.
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003
Annual Salary Range for jobs which could be performed in the US:
$204,500.00-$288,710.00Salary range dependent on a number of factors including location and experience.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.If an employer mentions a salary or salary range on their job, we display it as an "Employer Estimate". If a job has no salary data, Rise displays an estimate if available.
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