Northrop Grumman Space Systems, Payload and Ground Systems is seeking a motivated Mechanical Engineer to join our high-performance team. This position supports our Remote Sensing Program (RSP) Business Unit in Linthicum, MD.
The qualified candidate will work with a diverse and talented team of engineers developing innovative systems that support a broad range of products and business areas throughout the lifecycle of a program. The candidate will support the design of space hardware, with a focus on electronics design and packaging, and associated support equipment for antennas / electro-optical sensors, sensor structures, electronics chassis, circuit card assemblies, and electronic subassemblies and components.
The engineer will also be involved during all phases of Space Programs, from concept design through hardware integration and test efforts.
Typical roles and responsibilities include, but are not limited to:
Responsible for all aspects of hardware development. This will encompass all phases of design, including concept and detailed design development, CAD modeling efforts, documentation release, fabrication, integration, factory support and testing.
Responsible for understanding technical performance of mechanical requirements of space program hardware or subsystems of major satellite programs to assure cost, schedule and technical performance is achieved.
Present technical solution and technical data at milestone reviews.
Research and develop procedures, methods, and tools for testing space hardware conformance to documented and derived system requirements.
Ability to successfully read and interpret schematics, block diagrams, sketches, oral and written instructions, manufacturer's specifications/operation manuals, and analyze hardware configurations.
Ability to work independently and collaborate as part of a cross-functional team with other engineers, management, and contractors.
Troubleshoot hardware issues and/or nonconformances during integration and test and provide suggestions for improvement and optimization.
This position can be filled at the Principal Engineer (Level 3) or Senior Principal Engineer (Level 4) position based upon the candidate’s qualifications.
Basic Qualifications:
Principal (Level 3): B.S degree in a STEM field with 5 years of engineering experience; Master’s degree in STEM and 3 years of engineering experience.
Senior Principal Engineer (Level 4): B.S degree in a STEM field with 8 years of engineering experience; Master’s degree in STEM and 6 years of engineering experience, or a Ph.D. and 3 years of engineering experience
Strong experience using CAD modeling software and tools
Ability to develop clear and concise documentation and review materials
No clearance required to start but must be able to obtain and maintain a Top Secret Clearance.
Preferred Qualifications:
Experience with electronics packaging and design, inclusive of Printed Wiring Board (PWB) and Circuit Card Assembly (CCA) design and oversight
Experience designing mechanical ground support equipment and usage documentation
Excellent communication, interpersonal skills, and the ability to interface with all levels of employees and management
Active, in scope DoD Top Secret or SCI clearance
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