Browse 11 exciting jobs hiring in Emc Engineer now. Check out companies hiring such as Shield AI, Array Labs, Echo Neurotechnologies in Gilbert, Atlanta, Anchorage.
Electromechanical Engineer II to design and integrate avionics packaging and mechanical systems for Shield AI’s next-generation autonomous aircraft.
Lead the design and delivery of power management systems for Array Labs' formation-flying radar imaging satellites, moving concepts to flight-ready production.
Echo Neurotechnologies is hiring a Lead Electrical Test Engineer to lead system-level verification, validation, and production test development for implantable and wearable BCI medical devices.
Experienced EMC Engineer needed to lead complex emissions, immunity, and RF susceptibility testing for mission-critical systems in highly regulated environments.
Senior Electrical Integration Engineer needed in Atlanta to drive embedded hardware bring-up, system-level integration, and test for high-performance defense platforms.
Work on high-speed PCB and system-level electronic designs at Intuitive to help develop next-generation robotic surgical systems and transition them into production.
AMS Corporation is hiring an Electromagnetic Compatibility Engineer to lead EMC/EMI testing, troubleshooting, and reporting for nuclear and other safety-critical systems from our Knoxville lab and at customer sites.
Planet is hiring a Senior Electrical Engineer to lead analog, power, and mixed-signal electrical design and production readiness for its satellite constellation in a hybrid San Francisco role.
Experienced mechanical engineer needed to drive electronics packaging and spacecraft hardware design, analysis, and qualification for CesiumAstro’s satellite and airborne communication products.
Lead RF hardware and system design for phased-array satellite and aerospace communications at CesiumAstro, owning designs from concept through manufacturing, test, and in-orbit support.
Marvell is hiring a Staff Package Development Engineer to drive signal and power integrity, modeling, and qualification for advanced high-speed IC packages supporting 448 Gb/s and higher.
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