Process Development Principal Engineer

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

As a Process Development Principal Engineer at Solidigm you will be responsible for delivering module capability for the next node on the 3D NAND technology roadmap, partnering with the development team at the factory, as well as engaging with equipment vendors to deliver cost-effective and manufacturable process technology.

Key Responsibilities

• Lead the development and optimization of processes for 3D NAND semiconductor manufacturing
• Collaborate with cross-functional teams to identify and solve process issues and drive yield improvement
• Utilize your strong understanding of process principles, equipment, and materials to design and implement innovative solutions as well as driving cost reduction
• Conduct experiments and analyze data to make data-driven decisions for process improvements
• Monitor and track process performance, identify areas for improvement, and implement corrective actions
• Stay updated on industry trends and advancements in dry etch technology and integrate them
• Train and mentor junior engineers on processes and techniques
• Collaborate with equipment suppliers to ensure the smooth integration of new equipment and processes
• Contribute to the development of new process technologies to maintain competitive edge in the industry

Required Qualifications:

• A Master's degree in Electrical Engineering, Material Science Engineering, Physics, or similar technical degree.
• 15+ years experience semi-conductor industry experience
• 10+ years direct process development experience
• Established track record of innovation and results

Preferred Qualification

• The ideal candidate will have direct experience in 3D NAND process development.

The compensation range for this role is $180,270 - $301,400. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location. 

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