Browse 3 exciting jobs hiring in Advanced Packaging now. Check out companies hiring such as Intel, Amat, FM in Louisville/Jefferson County, Bakersfield, Cleveland.
Intel's Advanced Packaging team is seeking a Module Engineer On Shift (MEOS) to provide hands-on, overnight factory support for substrate and wafer assembly manufacturing.
Lead product strategy and cross-functional execution for advanced packaging product lines at Applied Materials, translating wafer-level and interconnect technologies into market-winning solutions.
Intel is hiring an Engineering Commodity Manager to drive substrate sourcing strategy, supplier development, and capacity planning for Foundry Services in Phoenix.
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