Browse 4 exciting jobs hiring in Thermal Simulation now. Check out companies hiring such as Broadcom, Analog Devices, Cyngn in Madison, Toledo, Plano.
Experienced Reliability Engineer needed to lead biased-stress and HTOL qualification projects for Broadcom's silicon and packaging products at the Fort Collins REL lab.
Experienced Mechanical/Packaging engineer needed to develop and validate passive components and SiP modules using SolidWorks and ANSYS Maxwell while managing component development and manufacturability for ADI's San Jose site.
Lead end-to-end mechanical design and release of vehicle subsystems at a fast-moving, publicly traded autonomous vehicle company serving industrial customers.
Work with a leading chiplet interconnect startup as a Senior/Staff Packaging Engineer driving electro-thermal simulation, PI/EM analysis, and chip-package co-simulation for advanced 2.5D/3D and chiplet-based designs.
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