Advanced Packaging & Systems Application Engineer

Boston Materials produces advanced materials with enhanced energy transfer properties using its patented Z-axis Carbon Fiber technology. The Company's products solve critical performance bottlenecks in applications spanning thermal, electrical, and structural use cases. Its breakthrough Liquid Metal ZRT thermal interface material is designed for the most demanding AI Infrastructure. Boston Materials is committed to expanding high-volume manufacturing in the United States. For more information, visit https://www.bomaterials.com/

ABOUT THE OPPORTUNITY

Not often in one’s career do we get the chance to—

Get close to the mission. Getting a real sense of what the business does and how our work directly affects the outcome. Where everyone is involved with the company’s success. No layers, no silos, no bureaucracy. Just the opportunity to make the greatest impact with the most responsibility.

Move faster. Adapting to changes in the market at record speed. No multi-layer signoffs and approvals. Instead, the latitude needed to get a new idea, product, or process off the ground quickly. Where we can experiment and test new ideas— and are encouraged to do so. We create solutions to problems that our customers truly care about, and we understand that customers won’t wait for us to figure them out.

Branch beyond the role. We’re not defined by past experiences or confined by our current job description. Every day offers opportunities to have influence and be challenged with new projects and tasks. Working shoulder-to-shoulder with some of the top talent in the industry, we’re able to showcase our talents, expand our knowledge, develop new skills, and take ownership and act. All while contributing to the overall success of the organization.

Create critical solutions. Join us to solve the most critical challenges facing the Advanced Semiconductor, AI Infrastructure, and Advanced Materials industries.

Opportunity knocks at Boston Materials. Will you answer the call?

Solve one of the most critical challenges facing the Semiconductor and Electronics Industry – thermal management! Join the Boston Materials team to help unlock the full potential of Z-axis Fiber™ technology and pave the way for groundbreaking advancements powering AI.

The Role

We are seeking a highly motivated Applications Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.

• Act as the primary technical point of contact for ODM, OSAT, and hyperscaler engineering teams during early and mid-stage engagement.
• Work closely with business development to uncover and document customer requirements, including thermal budgets, reliability standards, and process/package constraints.
• Lead internal scoping and coordination of customer-specific technical work, including reliability testing, and evaluation of alternative product variants, compliance ranges, or gaskets.
• Prepare and deliver technical collateral such as application notes, design guides, and data reports to support customer decision-making and qualification processes.
• Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams.
• Capture customer feedback and synthesize insights to guide internal product development and roadmap planning.
• Partner with sales and business development teams to provide pre-sales technical support and contribute to the overall customer success strategy.
• Gather and synthesize customer feedback (e.g., on performance, handling, supply chain needs) and bring it back to the product team.

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 3–7 years of experience in semiconductor packaging, thermal interface materials, or applications engineering in a B2B technical product company.
• Strong understanding of semiconductor packaging processes (flip-chip, 2.5D/3D integration, TIM1/TIM1.5/TIM2) and associated reliability testing (uHAST, TCT, HTS, etc.).
• Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.
• Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.
• Hands-on experience with lab testing, data analysis, and report generation; familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus.

• Health, Vision & Dental – Boston Materials pays 75% of Health, Vision and Dental Care coverage for employee and dependents
• 401(k) plan
• 4 weeks of supplemental Paid Parental and Family Leave
• Unlimited Paid Time Off
• Holidays: 14 days/year

Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.

Applicants must be currently authorized to work in the US on a full-time basis.